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Bui,  Trinh Dung

Simulation-based investigation of microwave treatments for printed circuit boards  : exemplified by coating cures

Rostock : Universität , 2014

https://doi.org/10.18453/rosdok_id00001442

http://purl.uni-rostock.de/rosdok/id00001442

Abstract:

Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.

Dissertation Open Access


Einrichtung :
Fakultät für Informatik und Elektrotechnik
Gutachter :
Nowottnick,  Mathias  (Prof. Dr.-Ing. habil.)
Schacht,  Ralph  (Prof. Dr.-Ing.)
Hohlfeld,  Dennis  (Prof. Dr.-Ing.)
Jahr der Abgabe:
2014
Jahr der Verteidigung:
2014
Sprache(n) :
Englisch
Schlagworte:
Simulation, microwave heating, printed circuit boards, curing process, COMSOL multiphysics
DDC Klassifikation :
000 Allgemeines, Wissenschaft
URN :
urn:nbn:de:gbv:28-diss2014-0194-8
Persistente URL:
http://purl.uni-rostock.de/rosdok/id00001442
erstellt am:
2014-11-28
zuletzt geändert am:
2018-06-30
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