mycoreobjectrosdok_disshab_0000001263rosdok_disshab_0000001263rosdokdisshabrosdok_derivate_00000219142023-08-08T10:05:26.953Z2014-11-28T14:14:43.525ZadministratoreditorDpublished1rosdok_derivate_0000021914truetruederivate_types:fulltextVolltextfulltextwf_edit_epub wf_register_epubstate:publishedstate:publishedveröffentlichtpublishedrosdok/id00001442812371984MODS updated during RosDok migration in June 2021DissertationHochschulschrift1062851293Trinh DungBui1981-VerfasserInautSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesen115095489Prof. Dr.-Ing. habil.MathiasNowottnickUniversität Rostock, Institut für Gerätesysteme und SchaltungstechnikAkademischeR BetreuerIndgsProf. Dr.-Ing.RalphSchachtBTU Cottbus-Senftenberg, Elektronische SchaltungstechnikAkademischeR BetreuerIndgs1048163369Prof. Dr.-Ing.DennisHohlfeldUniversität Rostock, Institut für Gerät Systeme und SchaltungstechnikAkademischeR BetreuerIndgs10085032-7Universität RostockFakultät für Informatik und ElektrotechnikGrad-verleihende Institutiondgg10.18453/rosdok_id00001442http://purl.uni-rostock.de/rosdok/id00001442urn:nbn:de:gbv:28-diss2014-0194-8000 Allgemeines, WissenschaftFakultät für Informatik und Elektrotechnikfrei zugänglich (Open Access)Lizenz Metadaten: CC0Nutzungsrechte erteiltalle Rechte vorbehaltenUniversität RostockRostock2014monographic20142014Universitätsbibliothek RostockRostock20142014Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.Simulationmicrowave heatingprinted circuit boardscuring processCOMSOL multiphysicsUniversitätsbibliothek Rostockhttp://purl.uni-rostock.de/rosdok/id00001442doctype:epubdoctype:epubDokumenttypDocument typedoctype:epub.dissertationdoctype:epub.dissertationDissertationdoctoral thesisdiniPublType:doctoralThesis diniPublType2022:PhDThesis XMetaDissPlusThesisLevel:thesis.doctoralinfo:eu-repo/semantics/doctoralThesisdocumentnatureOfContent:ppn_105825778natureOfContent:ppn_105825778HochschulschriftdiniPublType2022:DoctoralThesisdiniPublType2022:DoctoralThesisDissertation oder HabilitationDoctoral thesisDRIVERdiniPublType2022:PhDThesisdiniPublType2022:PhDThesisDissertationPhD thesisKDSF (Pu34)XMetaDissPlusThesisLevel:thesis.doctoralXMetaDissPlusThesisLevel:thesis.doctoralDoktorarbeitdoctoral thesisrfc5646:enrfc5646:enEnglischEnglishengengSDNB:000SDNB:000000 Allgemeines, Wissenschaft000 Generalities, Scienceinstitution:unirostockinstitution:unirostockUniversität RostockUniversity of RostockUniversität RostockUniversität RostockUni.Rostockhttp://d-nb.info/gnd/38329-6institution:unirostock.iefinstitution:unirostock.iefFakultät für Informatik und ElektrotechnikFaculty of Computer Science and Electrical EngineeringUniversität Rostock. Fakultät für Informatik und ElektrotechnikFakultät für Informatik<br />und ElektrotechnikUni.Rostock.Fakultaet.IEFhttp://d-nb.info/gnd/10085032-7accesscondition:openaccessaccesscondition:openaccessfrei zugänglich (Open Access)open accesshttp://purl.org/coar/access_right/c_abf2OAfreeinfo:eu-repo/semantics/openAccess[DE-28]Open Access$gControlled Vocabulary for Access Rights$uhttp://purl.org/coar/access_right/c_abf2licenseinfo:metadatalicenseinfo:metadataLizenzen für Metadatenlicenseinfo:metadata.cc0licenseinfo:metadata.cc0Lizenz Metadaten: CC0license metadata: CC0/creativecommons/p/zero/1.0/88x31.pnghttps://creativecommons.org/publicdomain/zero/1.0/licenseinfo:depositlicenseinfo:depositVeröffentlichungsgenehmigungpermission to storelicenseinfo:deposit.rightsgrantedlicenseinfo:deposit.rightsgrantedNutzungsrechte erteiltrights grantedlicenseinfo:worklicenseinfo:workWerkworklicenseinfo:work.rightsreservedlicenseinfo:work.rightsreservedalle Rechte vorbehaltenall rights reserved/creativecommons/r/reserved/0.9/88x31.png[DE-28]Urheberrechtsschutz 1.0$gRights Statements$uhttp://rightsstatements.org/vocab/InC/1.0/http://rightsstatements.org/vocab/InC/1.0/http://rightsstatements.org/vocab/InC/1.0/Simulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesgnd:1062851293gnd:115095489gnd:1048163369gnd:10085032-7gnd:1062851293gnd:115095489gnd:1048163369gnd:10085032-7rosdok_disshab_0000001263-d764862e39gnd:1062851293Trinh Dung BuiTrinh Dung Buirosdok_disshab_0000001263-d764862e61gnd:115095489Prof. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. habil. Mathias Nowottnickrosdok_disshab_0000001263-d764862e76Prof. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Ralph Schachtrosdok_disshab_0000001263-d764862e89gnd:1048163369Prof. Dr.-Ing. Dennis HohlfeldProf. Dr.-Ing. Dennis Hohlfeldrosdok_disshab_0000001263-d764862e105gnd:10085032-7Universität Rostock Fakultät für Informatik und ElektrotechnikUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiProf. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Dennis HohlfeldUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiProf. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Dennis HohlfeldUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiRostockUniversität Rostockepub.dissertation10.18453/rosdok_id00001442http://purl.uni-rostock.de/rosdok/id00001442urn:nbn:de:gbv:28-diss2014-0194-8Simulationmicrowave heatingprinted circuit boardscuring processCOMSOL multiphysicsCoatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.20142014epub.dissertation1 Dissertation_Bui_2014.pdf 3900008 3820e0f514976b60f25f1b4c2f403a58 rosdok/id00001442812371984MODS updated during RosDok migration in June 2021DissertationHochschulschrift1062851293Trinh DungBui1981-VerfasserInautSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesen115095489Prof. Dr.-Ing. habil.MathiasNowottnickUniversität Rostock, Institut für Gerätesysteme und SchaltungstechnikAkademischeR BetreuerIndgsProf. Dr.-Ing.RalphSchachtBTU Cottbus-Senftenberg, Elektronische SchaltungstechnikAkademischeR BetreuerIndgs1048163369Prof. Dr.-Ing.DennisHohlfeldUniversität Rostock, Institut für Gerät Systeme und SchaltungstechnikAkademischeR BetreuerIndgs10085032-7Universität RostockFakultät für Informatik und ElektrotechnikGrad-verleihende Institutiondgg10.18453/rosdok_id00001442http://purl.uni-rostock.de/rosdok/id00001442urn:nbn:de:gbv:28-diss2014-0194-8000 Allgemeines, WissenschaftFakultät für Informatik und Elektrotechnikfrei zugänglich (Open Access)Lizenz Metadaten: CC0Nutzungsrechte erteiltalle Rechte vorbehaltenUniversität RostockRostock2014monographic20142014Universitätsbibliothek RostockRostock20142014Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.Simulationmicrowave heatingprinted circuit boardscuring processCOMSOL multiphysicsUniversitätsbibliothek Rostockhttp://purl.uni-rostock.de/rosdok/id00001442 2014-11-28T14:14:43.525Z 2023-08-08T10:05:26.953Z 2023-08-18T10:05:26.958Z editorD {"identifier":"rosdok/id00001442","type":"local_id","additional":"","service":"MCRLocalID","created":"2018-06-30T13:12:46.848Z"} {"identifier":"http://purl.uni-rostock.de/rosdok/id00001442","type":"purl","additional":"","service":"RosDokPURL","created":"2018-06-30T13:12:46.975Z","registered":"2018-06-30T13:12:46.975Z"} {"identifier":"10.18453/rosdok_id00001442","type":"doi","additional":"","service":"RosDokDOI","created":"2018-06-30T13:12:48.270Z","registered":"2018-06-30T13:12:48.270Z"} {"identifier":"urn:nbn:de:gbv:28-diss2014-0194-8","type":"dnbUrn","additional":"","service":"RosDokURN","created":"2018-06-30T13:12:46.853Z","registered":"2014-12-10T03:07:55.740Z"} administratorfulltextfile/rosdok_disshab_0000001263/rosdok_derivate_0000021914/Dissertation_Bui_2014.pdfSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesgnd:1062851293gnd:115095489gnd:1048163369gnd:10085032-7gnd:1062851293gnd:115095489gnd:1048163369gnd:10085032-7rosdok_disshab_0000001263-d764862e39gnd:1062851293Trinh Dung BuiTrinh Dung Buirosdok_disshab_0000001263-d764862e61gnd:115095489Prof. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. habil. Mathias Nowottnickrosdok_disshab_0000001263-d764862e76Prof. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Ralph Schachtrosdok_disshab_0000001263-d764862e89gnd:1048163369Prof. Dr.-Ing. Dennis HohlfeldProf. Dr.-Ing. Dennis Hohlfeldrosdok_disshab_0000001263-d764862e105gnd:10085032-7Universität Rostock Fakultät für Informatik und ElektrotechnikUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiProf. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Dennis HohlfeldUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiProf. Dr.-Ing. habil. Mathias NowottnickProf. Dr.-Ing. Ralph SchachtProf. Dr.-Ing. Dennis HohlfeldUniversität Rostock Fakultät für Informatik und ElektrotechnikTrinh Dung BuiRostockUniversität Rostockepub.dissertation10.18453/rosdok_id00001442http://purl.uni-rostock.de/rosdok/id00001442urn:nbn:de:gbv:28-diss2014-0194-8Simulationmicrowave heatingprinted circuit boardscuring processCOMSOL multiphysicsCoatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.20142014[xslt]Saxonrosdok/id00001442https://purl.uni-rostock.de/rosdok/id0000144281237198410.18453/rosdok_id00001442urn:nbn:de:gbv:28-diss2014-0194-8Trinh Dung BuiBui Trinh DungSimulation-based investigation of microwave treatments for printed circuit boards : exemplified by coating curesDissertationdoctoral thesisUniversität Rostock, 2014Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic…Trinh Dung BuiSimulation-based investigation of microwave treatments for printed circuit boardsexemplified by coating curesUniversitätsbibliothek Rostockhttp://purl.uni-rostock.de/rosdok/id000014421062851293Trinh DungBui1981-VerfasserInaut115095489Prof. Dr.-Ing. habil.MathiasNowottnickUniversität Rostock, Institut für Gerätesysteme und SchaltungstechnikAkademischeR BetreuerIndgsProf. Dr.-Ing.RalphSchachtBTU Cottbus-Senftenberg, Elektronische SchaltungstechnikAkademischeR BetreuerIndgs1048163369Prof. Dr.-Ing.DennisHohlfeldUniversität Rostock, Institut für Gerät Systeme und SchaltungstechnikAkademischeR BetreuerIndgs10085032-7Universität RostockFakultät für Informatik und ElektrotechnikGrad-verleihende Institutiondgg[doi]10.18453/rosdok_id00001442[purl]http://purl.uni-rostock.de/rosdok/id00001442[urn]urn:nbn:de:gbv:28-diss2014-0194-8open_access20142014epoch:21th_centuryrfc5646:endoctype:epub.dissertationaccesscondition:openaccessSDNB:000institution:unirostock.iefstate:published