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Dirk Seehase

Integrierte Heizstrukturen in Leiterplatten

Universität Rostock, 2019

Abstract: Within the scope of the present work, integrated heating structures in circuit boards are to be manufactured and their applicability evaluated. As an advantage, a more efficient transfer of heat energy from a heating structure towards an electronic system (PCB/assembly), into which this structure was integrated, is seen. Furthermore, endogenously heated printed circuit boards could generate added value compared to current exogenous heating processes. For the practical solution the inductive heating as well as Joule heating will be pursued.

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