Universität Rostock, 2021
Abstract: The newly found conductive anodic migration phenomenon (AMP) forms under high electric voltage and simultaneous moisture load between oppositely charged conductive tracks. It is found mainly in the solder resist but also in the base material of the printed circuit board. Potential consequences are short circuits and in consequence failure of the high voltage printed circuit board. This work contains a detailed description of this new phenomenon and presents variables that influence the characteristics and intensity of the AMP which can be used to eliminate the phenomenon.
doctoral thesis free access